temporary bonding solutions

[Sebastian Sosin]

I am looking for a temporary bonding solution that can be removed without
solvents (heat, UV.). It may be glue or adhesive tape. Does anyone know any
products like this?

Regards,

Sebastian Sosin







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[Mathieu Foquet]

Revalpha thermal release tape is one idea. (Nitto Denko)

-----Original Message-----
From: mems-talk-***@memsnet.org
[mailto:mems-talk-***@memsnet.org] On Behalf Of Sebastian Sosin
Sent: Sunday, November 05, 2006 7:54 AM
To: mems-***@memsnet.org
Subject: [mems-talk] temporary bonding solutions


I am looking for a temporary bonding solution that can be removed
without solvents (heat, UV.). It may be glue or adhesive tape. Does
anyone know any products like this?

Regards,

Sebastian Sosin
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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[ssood]

Sebastian,

Mitsui Chemicals sells water soluble tapes ( sold under trade name ICROS)
which should work for you. These tapes are soluble in water and are
excellent for temporary wafer bonding. You don't need heat or any other
solvents for removal.

Sumant Sood
Belford Research Inc.

-----Original Message-----
From: mems-talk-***@memsnet.org [mailto:mems-talk-***@memsnet.org]
On Behalf Of Mathieu Foquet
Sent: Monday, November 06, 2006 12:27 PM
To: Sebastian Sosin; mems-***@memsnet.org
Subject: RE: [mems-talk] temporary bonding solutions

Revalpha thermal release tape is one idea. (Nitto Denko)

-----Original Message-----
From: mems-talk-***@memsnet.org
[mailto:mems-talk-***@memsnet.org] On Behalf Of Sebastian Sosin
Sent: Sunday, November 05, 2006 7:54 AM
To: mems-***@memsnet.org
Subject: [mems-talk] temporary bonding solutions


I am looking for a temporary bonding solution that can be removed without
solvents (heat, UV.). It may be glue or adhesive tape. Does anyone know any
products like this?
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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[Barrie VanDevender]

This should work fine for 250um thick material.


-----Original Message-----
From: mems-talk-***@memsnet.org [mailto:mems-talk-***@memsnet.org]
On Behalf Of Mathieu Foquet
Sent: Monday, November 06, 2006 12:28 PM
To: Sebastian Sosin; mems-***@memsnet.org
Subject: RE: [mems-talk] temporary bonding solutions

Revalpha thermal release tape is one idea. (Nitto Denko)

-----Original Message-----
From: mems-talk-***@memsnet.org
[mailto:mems-talk-***@memsnet.org] On Behalf Of Sebastian Sosin
Sent: Sunday, November 05, 2006 7:54 AM
To: mems-***@memsnet.org
Subject: [mems-talk] temporary bonding solutions

I am looking for a temporary bonding solution that can be removed
without solvents (heat, UV.). It may be glue or adhesive tape. Does
anyone know any products like this?
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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[Brubaker Chad]

Sebastian,

It depends on the degree to which you mean "without solvents", and the degree of temperature resistance you need.

First, there are a series of thermal release tapes (two different brands - Rexpan and Revalpha) with different grades of release temperatures from 90ºC to 170ºC. They release very clean just from heat processing. Keep in mind however that these are thermal release materials - the safe operating zone is ~20 degrees below the release temperature.

A second option is Sekisui UV release tapes. These have, overall, a greater temperature resistance, but they do not appear to release as cleanly as the thermal tapes.

Finally, there are a line of materials recently developed by Brewer Science in conjunction with EVG.

These materials are spin on polymers which are also designed for a thermal release (primarily slide-off). There is no solvent required for the removal process; however, there will be some residues that need cleaning following the debond process.

A couple papers for reference:

H. Kirchberger, S. Pargfrieder, P. Kettner, C. Schaefer, "Production Proven Temporary Bonding and De-Bonding Equipment and Technology," PROC. SEMI-ECS ISTC, SemiCON China, March 15-17, 2005

S. Pillalamarri, C.Brubaker, M. Wimplinger, S. Pargfrieder, "High-Temperature Spin-On Adhesives for Temporary Wafer Bonding," PROC. IMAPS 2006, San Diego, Oct 10 - 12, 2006

Best Regards,
Chad Brubaker

EV Group invent * innovate * implement
Technology - Tel: [phone], Fax: [phone] e-mail: ***@EVGroup.com, www.EVGroup.com

-----Original Message-----
From: mems-talk-***@memsnet.org [mailto:mems-talk-***@memsnet.org] On Behalf Of Sebastian Sosin
Sent: Sunday, November 05, 2006 8:54 AM
To: mems-***@memsnet.org
Subject: [mems-talk] temporary bonding solutions


I am looking for a temporary bonding solution that can be removed without
solvents (heat, UV.). It may be glue or adhesive tape. Does anyone know any
products like this?
_______________________________________________
Hosted by the MEMS and Nanotechnology Exchange, the country's leading
provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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